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Since
its establishment, Yeh-chiang Technology Co. adhered
building up its own technology and innovation. The
R&D group of electronics materials division
was composed of top bench scientist in many field
such as chemistry, chemical engineering and material
science. Besides scientist, there was also a full-time
team doing analytical work and supporting the IQC
requirement of our thermal component division. |
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Based
on aforetime product, Sn/Pb solder paste and lead-containing
silver paste, we developed green products including: |
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Lead-free
solder paste for SMT usage: Sn/Ag/Cu solder
paste and Sn/Ag solder paste. |
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Lead-free Sn/Bi solder paste for thermal component. |
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Various
lead-free silver pastes for ceramic capacitor,
varistor…etc. |
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Low-temperature
curable silver paste for membrane switch and
FPC usage. |
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Silver-filled
epoxy resin for die attach applications. |
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Copper
micro-heat-spreader: |
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| Wet
Etching |
| Metal
Injection Molding |
| Electrical
Plating |
| Stamping |
| Laser
Manufacturing, etc. |
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Si-based
micro heat spreader |
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Micro
heat spreader can be applied on integrated circuit
(or chip) assembly to disperse surface hot spot
to every corner based on liquid phase change principle.
Once the high density hot spot on chip surface can
be dispersed rapidly, the chip integration and operation
speed can be much improved. We believe that the
current IHS will be replace with such a micro heat
spreader for high power IC assembly application
in the near future |
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3°C
